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da6240 c . 00 7 1 7 october , 201 6 1 ( 13 ) mas 6240 c piezo driver with multi - mode charge pump ? both single ended and differential output ? three - step volume adjusting ? up to 18vpp output from 3v supply ? one wire audio & shutdown control ? high efficiency ? solution without inductors ? low external pa rt count description mas 6240 is a piezo driver device that can drive outputs up to 18vpp from 3v supply. an internal three - mode charge pump generates boosted supply voltage for piezo driver. for adjusting the piezo element sound volume , the charge pump can operate in either of a 1x, 2x or 3x mode. in 1x mode the output voltage is same to the input voltage , in 2x or 3x mode the input voltage is boosted up accordingly 2 or 3 times. charge pump mode is selected by control pins en1 and en2 (see table 2 on pa ge 3 ). mas 6240 is an easy and low - cost solution for piezo driver, since only 4 small value capacitors are needed in addition to sound element - the use of inductors can be avoided. the inductorless design also causes significantly less disturbance to the surrounding circuits making it an ideal choice for sensitive designs. its charge pump switches at 1mh z , allowing to using as small as 100nf external capacitors. control logic is switching the charge pump on at first rising signal o f digital input ( d in) pi n . the piezo driver is enabled at a second rising edge of a pulse at d in and the signal is transferred to piezo output vo1. the same signal is inverted into output vo2 for using differential output. the charge pump and piezo driver disable signal will be g enerated while the signal at din has been at low mostly for 50ms. when disabled the piezo driver outputs vo1 and vo2 are pulled actively to gnd. continuous logic high level at d in input causes the charge pump to be turned on but leaves the piezo driver di sabled. in that state the vout charge pump output of the mas6240c2 version can be used to power the external led or any other external circuit up to 5ma load . the output voltage is still selectable at three steps. in "disabled" mode (d in has been low for 15 ms typically ) all functional blocks are switched off to achieve the quiescent current less than 1a. two qfn packaged device versions are available. c1 version has short circuit protection which limits input current taken from the supplies . it is suitab le for driving piezo in single ended configuration. c2 version does not have input current limitation but it provide s maximum output current drive capability and loudest sound pressure level . it is suited for driving piezo in both single ended and differen tial configurations. in the die form version d1 the input current limitation is selectable by bonding. features applications piezo driver & charge pump ? thin qfn 2x2 and 3x3 12 ld package s ? three - step volume adjusting ? both single ended and differential out put ? up to 18vpp output from 3v supply ? one wire audio & shutdown control ? low external part count ? inductorless low emi s olution ? wrist watches ? alarm clocks ? handheld gps devices ? pdas ? po rtable device with sound feature ? 1 mhz switching frequency ? mu lti - mode charge pump (1x/2x/3x)
da6240 c . 00 7 1 7 october , 201 6 2 ( 13 ) block & application diagram figure 1 . c1 or c2 version charge pump + single end piezo driver (max 9vpp) figure 2 . c2 version charge pump + differential piezo driver (m ax 18vpp) the application figures 1 and 2 include optional 1k 2k output protection resistor which offers an extra protection for the over voltage that the piezo element could generate in a mechanical shock. the input (cin) , fly (cfly1, cfly2) and outpu t (cout) capacitor value selection s affect output ripple and inrush current drawn from input during startup. see table 1 for selecting capacitor v alues at different applications . the capacitors mu st be ceramic type with low esr and meeting following minimu m voltage ratings: min 6.3v for cin and cfly1 - cfly 2 and min 16v for cout. table 1 . capacitor value selections at different applications cin cfly1 - 2 cout application 100nf 100nf 100nf minimum size layout but increased inrush curren t 10 f 100nf 100nf battery cell operated device with low startup inrush current 10 f 100nf 1 f low output ripple application with medium inrush current 1x/2x/3x charge pump vout cp1 cn1 vin (3v) gnd din control logic oscillator 1mhz cfly1= 0.1uf cout= 0.1uf cin= 0.1uf en1 p iezo sounder cp2 cn2 cfly2= 0.1uf en2 short circuit protection vo1 vo2 900k pull down resistor mas6240c 1/c 2 1k 2k output protection (optional) p iezo sounder 1k 2k output protection (optional) 1x/2x/3x charge pump vout cp1 cn1 vin (3v) gnd din control logic oscillator 1mhz cfly1= 0.1uf cout= 0.1uf cin= 0.1uf en1 cp2 cn2 fly2= 0.1uf en2 short circuit protection vo1 vo2 900k pull down resistor m as6240 c 2
da6240 c . 00 7 1 7 october , 201 6 3 ( 13 ) the voltage ripple at vout output is approximately proportional to ratio of piezo load capacitance and charge pump output capacitor (cout). thus the output ripple can be reduced by choosing cout which is much larger relative to piezo capacitance value. however the cout should not be chosen too large since it lengthens output voltage rise time and increa ses inrush current drawn from input. for low inrush current the cin should be made much larger than the cout. table 2 presents charge pump boosting modes selected by control pins en1 and en2. table 2 . charge pump boosting mode selection din en1 en2 charg e pump 0 - - off 1 0 0 off 1 0 1 1x mode (vin) 1 1 0 2x mode (2xvin) 1 1 1 3x mode (3xvin) note: in above table p ulsed signal at digital input din is taken as 1 if pulse low time is less than 5 ms! absolute maximum ratings parameter symbol cond itions min max unit supply voltage vin charge pump in 1x mode. charge pump in 2x or 3x mode. - 0.3 - 0.3 5.5 4.0 v outputs and flying capacitors pins voltages vout, cp2, vo1, vo2 - 0.3 12 v cp1, cn2, - 0.3 8 v voltage range for input pins din, en1, en2 , cn1 - 0.3 vin + 0.3 v vout short - circuit duration t sc valid for c1 version which has s hort circuit limitation . indefinite storage temperature - 55 +150 o c esd rating human body model (hbm) 2 kv note: stresses beyond the values listed may cause a permanent damage to the device. the device may not operate under these conditions, but it will not be destroyed. recommended operating conditions all voltages with respect to ground. parameter symbol conditions min typ max unit operating junc tion temperature t j - 40 +125 c operating ambient temperature t a - 40 +27 +85 c operating supply voltage v in 2. 2 3.0 3.3 v
da6240 c . 00 7 1 7 october , 201 6 4 ( 13 ) electrical characteristics t a = - 40c to +85c, typical values at t a = 27c, v in = 3.0 v, c 1 = 100 nf, c 2 = 100 nf, c out = 100 nf, c in = 100 nf, c piezo = 15 nf, digital input din= 4khz; unless otherwise specified parameter symbol conditions min typ max unit output voltage vout vout pin voltage towards ground at vin = 3 v , note 1 c1 version: load 15nf c2 version: load 05ma 1x mode 2x mode 3x mode 2.8 5.2 7.2 3 6 9 v shutdown current i sd din = 0v, note 2 1 a current consumption i cc charge pump (no load) : 1x mode 2x mode 3x mode 85 800 2100 15 0 15 00 3250 a single ended application (c piezo = 15 nf ; f=4khz ): 1x mode 2x mode 3x mode 0. 26 1 . 5 3.6 ma differential application (c piezo = 15 nf ; f=4khz ) : 1x mode 2x mode 3x mode , note 3 0. 8 3 . 5 7.6 ma signal frequency f audio 0.2 4 8 khz internal switching frequency (charge pump) f osc 0. 6 1 1.8 mhz vout turn - on time (from din signal high to 90% vout steady state) t on c1 version 1x mode 2x mode 3x mode 10 130 40 0 100 300 800 s c2 version 1x mode 2x mode 3x mode 6 30 60 100 200 300 s shut down delay t off time before device shu tdown after din signal goes to low 5 15 50 m s short circuit current i sc from vin pin , note 4 c1 version with current limitation c2 version 5 1 0 50 150 ma control input threshold v ih v il en1, en2, din pins 1.6 0. 55 v v control input current i ih i il v din = 3v, (900k ? pull down) v din = 0v 3.4 0 7 1 a a i ih i il v din = 3v v en1,en2 = 3v, (900k ? pull down) v en1,en2 = 0v 3.4 0 7 1 a a i ih i il v din = 0v , note 5 v en1,en2 = 3v v en1,en2 = 0v 0 0 1 1 a a note 1: c1 version is limited for capacitive load only . c2 version can be also used to drive dc - load from vout . note 2 : din has been low at least 50 ms. note 3 : for differential 3x mode it is recommended to use c2 version due to limited current drive capability of c1 version. note 4 : short circuit protection in 2x and 3x modes note 5 : en1 and en2 pins are at high - z state while v din =0v.
da6240 c . 00 7 1 7 october , 201 6 5 ( 13 ) detailed description figure 3 . enabling output vo1 the piezo dri ver is enabled at the second rising edge of the signal at d in, thus the signal is transferred to the piezo output vo1 . an inverted output vo2 is enabled at the same time, but it is optional to take it in use. control logic is switching the charge pump on a t first rising signal of digital input d in pin. if only one rising edge is fed to the input din, the piezo driver remains disa bled. this make s it possible to control e.g. a white led or other device through pin vout while charge pump is enabled , without e nabling the piezo driver . the vo1 and vo2 outputs are at gnd when the piezo driver is disabled. figure 4 . disabling vo2 figur e 4 is drawn in the case of vo2 . the charge pump and piezo driver disable signal will be generated a fter the signal a t din has been low at mostly for 5 0 ms. in the figure 4 the switch - off delay is about 1 5 ms. again when new pulses are fed into din, the charge pump and piezo driver will be enabled. mas6240 first pulse skipping -1 0 1 2 3 4 5 6 7 8 9 10 -20 0 20 40 60 time [ms] voltage [v] vo1 din mas6240 first pulse skipping & power down delay -1 0 1 2 3 4 5 6 7 8 9 10 -20 0 20 40 60 time [sec] voltage [v] din vo2
da6240 c . 00 7 1 7 october , 201 6 6 ( 13 ) device outline configuration top marking information: 240 & 1234 = product number c v = version number g = lead free, rohs compliant package y = year ww = week qfn - 12 2x2x0.5, qfn - 12 3x3 x0.75 pin description pin name pin type function note en1 1 di charge pump mode selection input 1 en2 2 di charge pump mode selection input 2 din 3 di enable signal + digital signal input cn1 4 a i/o flying capacitor 1 negative terminal gnd 5 g supply ground vo2 6 do digital audio signal outpu t 2 vo1 7 do digital audio signal output 1 cn2 8 a i/o flying capacitor 2 negative terminal cp1 9 a i/o flying capacitor 1 positive terminal vout 10 ao charge pump output cp2 11 a i/o flying capacitor 2 positive terminal vin 12 p power supply ex p_pad - p exposed pad connected to gnd 1 g = ground, p = power, d = digital, a = analog, i = input, o = output note 1 : on pcb the exposed can be either connected to gnd or left floating. 1 4 7 10 240 cvy qfn 2x2 12ld 1 4 7 10 1234 gcv yww qfn 3x3 12ld
da6240 c . 00 7 1 7 october , 201 6 7 ( 13 ) package (qfn 2 x 2 x 0.5 12ld) outline symbol min nom max unit pa ckage dimensions a 0. 45 0.5 0. 55 mm a1 0 0.02 0.05 mm b 0.15 0.2 0 0 .25 mm c 0.10 0. 15 0 .20 mm d 1 .90 2 .00 2 .10 mm d2 (exposed.pad) 1. 00 1. 10 1. 20 mm e 0. 4 0 bsc mm ne 0 . 8 0 bsc mm nd 0 . 8 0 bsc mm e 1.9 0 2 .00 2 .10 mm e2 (exposed.pad) 1. 00 1. 10 1. 20 mm l 0. 1 5 0. 2 0 0. 2 5 mm h 0. 15 0.2 0 0. 25 mm dimensions do not include mold or interlead flash, protrusions or gate burrs.
da6240 c . 00 7 1 7 october , 201 6 8 ( 13 ) qfn 2 x 2 x 0.5 12ld pcb land pattern notes ? i/o lands should be 0.2mm longer than qfn pads and extend the same 0.2mm outside package outline ? exposed pad land size should be the same as qfn exposed pad size ? solder resist opening should be 120 ? m150 ? m larger than the land size resulting in 60 ? m75 ? m clearance between copper land and solder resist
da6240 c . 00 7 1 7 october , 201 6 9 ( 13 ) package (qfn 3 x 3x0.75 12ld) outl ine symbol min nom max unit package dimensions a 0.70 0.75 0.8 0 mm a1 --- 0.02 0.05 mm b 0.20 0.25 0. 30 mm b2 0. 15 0.20 0.2 5 mm c 0.18 0.20 0.2 5 mm d 2.90 3.00 3.10 mm d2 (exposed.pad) 1. 55 1.65 1. 75 mm e 0.50 bsc mm ne 1.0 0 bsc mm nd 1.0 0 bsc mm e 2.90 3.00 3.10 mm e2 (exposed.pad) 1. 55 1.65 1. 75 mm l 0.3 5 0.40 0.4 5 mm h 0. 20 0.2 5 0. 3 0 mm dimensions do not include mold or interlead flash, protrusions or gate burrs.
da6240 c . 00 7 1 7 october , 201 6 10 ( 13 ) qfn 3 x 3x0.75 12ld pcb land pattern notes ? i/o lands should b e 0.2mm longer than qfn pads and extend the same 0.2mm outside package outline ? exposed pad land size should be the same as qfn exposed pad size ? solder resist opening should be 120 ? m150 ? m larger than the land size resulting in 60 ? m75 ? m clearance between c opper land and solder resist
da6240 c . 00 7 1 7 october , 201 6 11 ( 13 ) soldering information ? for lead - free / green qfn 2 mm x 2 mm x 0.5mm and 3mm x 3mm x 0.75mm resistance to soldering heat according to rsh test iec 68 - 2 - 58/20 maximum temperature 260 ? c maximum number of reflow cycles 3 re flow profile thermal profile parameters stated in ipc/jedec j - std - 020 should not be exceeded. http://www.jedec.org lead finish 7.62 - 25.4 m, matte tin qfn 2 x 2x0. 5 embossed tape specifications orientation on tape dimension min/max unit a 0 2.1 3 0. 0 5 mm b 0 2.13 0.05 mm d 1.50 0.1 mm d 1 1.00 +0.25 / - 0. 0 0 mm e 1.75 0.10 mm f 3 .50 0.05 mm k0 0 . 88 0.0 5 mm p 4.00 0.10 mm p0 4.0 0 0.10 mm 10 p 0 4 0 .0 0 0.2 0 mm p 2 2.0 0 0.05 mm t 0.254 0.02 mm w 8.00 +0.3/ - 0.1 mm ? 5 max reel material: conductive , plastic antistatic or static dissipative carrier tape material: conductive cover tape material: static dissipative user direction of feed
da6240 c . 00 7 1 7 october , 201 6 12 ( 13 ) qfn 3 x 3x0.75 embossed tape specifications orientation on tape dimension min/max unit a o 3.30 0.10 m m b o 3.30 0.10 mm d o 1.50 +0.1/ - 0.0 mm e 1.75 mm f 5.50 0.05 mm k o 1.10 0.10 mm p o 4.0 mm p 1 8.0 0.10 mm p 2 2.0 0.05 mm t 0.3 0.05 mm w 12.00 0.3 mm reel material: conductive , plastic antistatic or static dissipative carrier tape material: conductive cover tape material: static dissipative user direction of feed w p o p 1 d 0 x x e f t b 0 k 0 r 0.25 typ p 2 a 0
da6240 c . 00 7 1 7 october , 201 6 13 ( 13 ) ordering information product code product package comments mas6240c 1hp06 piezo driver with input current limit ing qfn 3x3x0.75 12ld, pb free, rohs compliant , msl=1 ?13 tape and reel 5 000 pcs / r mas6240c1hp 09 piezo driver with input current limiting qfn 3x3x0.75 12ld, pb free, rohs compliant , msl=1 tape 5 00 pcs mas6 240c2q2106 piezo driver without input current limiting qfn 2x2x0.5 12ld, pb free, rohs compliant, msl=1 ?7 tape and reel 3 000 pcs / r mas6240c2 hp06 piezo driver without input current limiting qfn 3x3x0.75 12ld, pb free, rohs compliant , msl=1 ?13 tape a nd reel 5 000 pcs / r mas6240c2hp 09 piezo driver without input current limiting qfn 3x3x0.75 12ld, pb free, rohs compliant , msl=1 t ape 500 pcs mas6240d 1tc00 piezo driver , input current limiting selectable by bonding ews tested 8 wafers , thickness 395 m mas6240d1tc05 piezo driver , input current limiting selectable by bonding 395 m thick dies in waffle pack ? the formation of product code an example for mas6240 c 1hp 06: mas6240 c 1 h p 06 product name design version product version package: h p = qf n 3 x 3 x 0.75 q21 = qfn 2 x 2 x 0.5 ( pb free, rohs compliant) delivery format: 00 = tested wafer 05 = tested dies 06 = tape and reel 09 = tape local distributor micro analog systems oy contacts micro analog systems oy kutomotie 16 fi - 00380 hels inki, finland tel. +358 10 835 1100 fax +358 10 835 1119 http://www.mas - oy.com notice micro analog systems oy (mas) reserves the right to make changes to the products contained in this data sheet in order to imp rove t he design or performance and to supply the best possible products. mas assumes no responsibility for the use of any circuits sho wn in this data sheet, conveys no license under any patent or other rights unless otherwise specified in this data sheet, and ma kes no claim that the circuits are free from patent infringement. applications for any devices shown in this data sheet are for illustration only a nd mas makes no claim or warranty that such applications will be suitable for the use specified without furth er testing or modification. mas products are not authorized for use in safety - critical applications (such as life support) where a failure of the mas product would reasonably be expected to cause severe personal injury or death. buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety - related requirements concerning their products and any use of mas products in such safety - critical applications, notwithstanding any applications - related information or support that may be provided by mas. further, buyers must fully indemnify mas and its representatives against any damages arising out of the use of mas products in such safety - critical applications. mas products are neither designed nor intended fo r use in military/aerospace applications or environments. buyers acknowledge and agree that any such use of mas products which mas has not designated as military - grade is solely at the buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. mas products are neither designed nor intended for use in automotive applications or environments. buyers acknowledge and agree that, if they use any non - designated products in automotive applications, mas will not be responsible for any failure to meet such requirements.

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